Self-aligned etch stop for polycrystalline silicon plugs on a semiconductor device

ABSTRACT

A method for providing a self-aligned etch stop layer comprises the steps of providing a dielectric layer having a polycrystalline silicon (poly) plug formed therein. An aluminum layer is formed to contact the dielectric layer and the plug, then the structure is heated. Heating the aluminum and the poly results in the absorption of the aluminum overlying the plug into the poly, while the aluminum overlying the dielectric is not absorbed. The aluminum over the dielectric is oxidized which forms a self-aligned etch stop layer. Layers are formed over the aluminum oxide and are subsequently etched. The etch stops on the aluminum oxide and the poly plug.

NOTICE OF CONTINUING APPLICATION

[0001] This is a continuation of U.S. application Ser. No. 09/325,317 filed Jun. 3, 1999 and issued Sep. 11, 2001 as U.S. Pat. No. 6,287,958.

FIELD OF THE INVENTION

[0002] This invention relates to the field of semiconductor manufacture, and more particularly to a method for forming a self-aligned etch stop layer.

BACKGROUND OF THE INVENTION

[0003] Semiconductor devices, including static and dynamic random access memories, microprocessors, logic devices, etc., commonly comprise polycrystalline silicon (poly) plugs or studs used as contacts. For example, poly plugs can be used to contact two levels of metal or as contacts for structures such as capacitors in dynamic random access memories (DRAMs).

[0004] To construct a structure comprising a poly plug, a conductive layer which the plug will contact is formed, then a first dielectric layer is deposited, masked, and etched to form a contact hole therein. A blanket poly layer is formed which fills the hole, then the poly layer is planarized such that poly is removed from horizontal surfaces but remains in the hole. Subsequently, a second dielectric layer is deposited and a mask is aligned such that an etch of the second dielectric layer will expose the poly plug. The second dielectric layer is often slightly over-etched to facilitate complete removal of the dielectric material from the contact to ensure the plug is exposed. A metal layer is formed by sputtering or chemical vapor deposition to fill the hole in the second dielectric layer and to contact the poly plug in the first dielectric layer.

[0005] With decreasing semiconductor device feature sizes it becomes increasingly difficult to accurately align the mask over the second dielectric layer with the poly plug so that the etched hole in the second dielectric layer strikes only the poly plug. Misaligning the mask results in the exposure and etching of the first dielectric layer during the etch of the second dielectric layer. Consequently, there is a high likelihood that a portion of the first dielectric material in the proximity of the plug will be etched, as this material is often similar to the material being etched above the plug. When a subsequent conductive layer is formed within the hole in the second dielectric layer, the material will fill the area around the plug. This can result in electrical shorting or altered electrical characteristics of the completed device.

[0006] An aluminum oxide etch stop layer has been proposed which reduces undesirable dielectric etches when forming contact holes to underlying layers. In such a process, a blanket aluminum layer is formed over the region to which contact is to be made and over a desirable dielectric layer such as a cap and a sidewall over a conductive line. The aluminum is oxidized, then a second dielectric layer is formed over the aluminum oxide and a patterned photoresist layer is formed over the second dielectric layer. The second dielectric layer is etched using the aluminum oxide as an etch stop. A second etch is performed which etches the aluminum oxide and stops on the first dielectric layer. This process, however, has the disadvantage that processes which etch aluminum oxide also etch poly. Thus, the aluminum oxide etch must be timed to prevent etching of the poly as the oxide is cleared from the plug. Timed etches lend themselves to under-etching, which can result in electrical opens, or to over-etching, which can result in shorting or forming structures with undesirable electrical properties.

[0007] A method for forming a structure such as the one above, or similar structures, which reduces or eliminates the stated problems would be desirable. Micron Technology, Inc. 2 98-0746.01

SUMMARY OF THE INVENTION

[0008] The present invention provides a new method that reduces problems associated with the manufacture of semiconductor devices, particularly problems resulting in the undesirable etching of material surrounding a feature such as a polycrystalline silicon plug. In accordance with one embodiment of the invention, a first dielectric layer having a silicon plug therein, such as a polycrystalline silicon plug, is formed such that the plug is electrically coupled with an underlying conductive layer. An oxidizable layer, for example aluminum, is blanket deposited over the plug and over the first dielectric layer. The assembly is annealed or otherwise processed to diffuse the aluminum in contact with the plug into the poly, thereby effectively removing the aluminum from the surface of the plug.

[0009] Subsequently, the aluminum layer is oxidized. If any aluminum remains on the surface of the plug and is oxidized during this oxidation, a brief etch can be performed. Any oxide which forms on the plug will be much thinner than the oxidized aluminum over the dielectric surface and can be quickly removed with minimal thinning of the aluminum oxide overlying the first dielectric layer.

[0010] Next, a second dielectric layer is formed over the plug and over the aluminum oxide layer. A patterned photoresist layer is formed over the second dielectric layer with openings over the plug region, and an etch is performed to remove the exposed second dielectric layer. The etch chemistry is such that it removes the second dielectric layer selective to aluminum oxide and poly. When the etch removes all the exposed portions of the second dielectric layer the plug and the aluminum oxide are exposed and etching stops.

[0011] Objects and advantages will become apparent to those skilled in the art from the following detailed description read in conjunction with the appended claims and the drawings attached hereto.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012]FIG. 1 is a cross section depicting a starting structure for forming a polycrystalline silicon (poly) plug within a first dielectric layer;

[0013]FIG. 2 is a cross section of the FIG. 1 structure after planarizing the poly layer to form the plug and a subsequent formation of an aluminum layer;

[0014]FIG. 3 depicts the FIG. 2 structure after an anneal step;

[0015]FIG. 4 is a cross section depicting the FIG. 3 structure after oxidation of the remaining aluminum and formation of a second dielectric layer and a misaligned photoresist layer;

[0016]FIG. 5 depicts the FIG. 4 structure after etching the second dielectric layer to form a contact opening to the poly plug;

[0017]FIG. 6 depicts the structure of FIG. 5 after forming a conductive layer contacting the poly plug; and

[0018]FIG. 7 is a cross section of one embodiment of the invention comprising the use of a barrier layer.

[0019] It should be emphasized that the drawings herein may not be to exact scale and are schematic representations. The drawings are not intended to portray the specific parameters, materials, particular uses, or the structural details of the invention, which can be determined by one of skill in the art by examination of the information herein.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0020] An embodiment of an inventive method for forming a self-aligned etch stop layer and an opening to a silicon layer, for example a polycrystalline silicon (poly) layer, is depicted in FIGS. 1-6. While the invention is described with reference to a poly plug, other silicon plugs such as a plug formed from an epitaxial silicon layer may also be useful. FIG. 1 depicts a conductive blanket poly layer 10 formed over a first dielectric layer 12, for example borophosphosilicate glass (BPSG), tetraethyl orthosilicate (TEOS) or silicon nitride, and within a hole in the first dielectric layer. To provide adequate conductivity, the poly layer can be heavily doped with an n-type or p-type dopant, depending on its use. The poly is electrically coupled with a conductively doped region 14 within a semiconductor wafer substrate assembly 16. Contact to the doped region 14 is for purposes of illustration only, as it will be appreciated that electrical coupling can be facilitated between the plug and various silicon, metal, and other conductive structures. A poly layer having a thickness of from about 200 angstroms (Å) to about 7,000 Å, a first dielectric layer having a thickness of about 10,000 Å, and a contact hole having a width of about 2,000 Å would be sufficient and can be formed according to means known in the art.

[0021] The poly layer 10 is planarized, for example using a chemical mechanical polishing process, to result in the plug 20 of FIG. 2. Subsequently, an oxidizable layer 22 such as a blanket aluminum layer is formed over the poly and the dielectric. Other metal layers, for example a magnesium layer or a zinc layer processed in accordance with manufacturing steps described herein for aluminum, may also be sufficient. An aluminum layer between about 45 Å and about 55 Å thick, and preferably about 50 Å thick, would be sufficient. An aluminum layer can be formed by means well known in the art. For example, a sputtered layer about 50 Å thick can be formed using conventional sputtering equipment at a power of 500 watts for about six seconds.

[0022] Next, the structure of FIG. 2 is processed to diffuse the aluminum 22 which overlies and contacts the poly plug 20 into the poly 20 to result in the structure of FIG. 3. This can be accomplished with an anneal step, for example by subjecting the structure to a temperature of between about 400° C. and about 500° C., for example about 400° C., for between about 30 seconds and about five minutes, preferably for about two minutes. The aluminum which contacts the poly is thereby diffused or absorbed into the poly. At most, only a minimal number of aluminum atoms will remain on the surface of the poly while the aluminum over the dielectric remains substantially unaltered as depicted in FIG. 3.

[0023] After diffusing the aluminum into the poly the remaining aluminum is oxidized to result in the aluminum oxide layer 40 as depicted in FIG. 4. For example, the aluminum can be exposed to an oxidizing atmosphere comprising oxygen (O₂) at a temperature of between about 250° C. and about 400° C. for between about 60 seconds and about five minutes for the 50 Å layer described above. This is sufficient to fully covert the aluminum to aluminum oxide.

[0024] If necessary, any aluminum on the surface of the poly plug which oxidizes can be removed with an etch of BCl₃ for between about five seconds and about 30 seconds. This will remove any aluminum oxide over the poly without excessive removal of the aluminum oxide overlying the first dielectric layer. It may be possible to perform this etch during an etch of an overlying oxide layer.

[0025] Next, an overlying oxide layer 42, for example BPSG or TEOS , is deposited and planarized to result in a layer of between about 2,000 Å and about 20,000 Å thick. A patterned photoresist 44 is formed to expose the aluminum oxide in the region where contact is to be made to the poly plug 20. An oxide etch, for example, a dry etch using CF₄, CHF₃ and, argon in a high density etcher will etch the overlying oxide layer 42 at a rate of about 8,000 Å/min and stop on (or in) the aluminum oxide etch stop layer 40 and the poly plug 20. If necessary, any oxide layer overlying the plug, for example an oxide layer formed during oxidation of the aluminum layer, can be performed after the etch stop layer is exposed to expose the plug.

[0026] The photoresist layer 44 is removed after the etch of the overlying dielectric 42 to result in the structure of FIG. 5. A conductive layer 50 is formed within the opening in the overlying dielectric layer 42 as depicted in FIG. 6. Wafer processing continues to form a semiconductor device according to means known in the art.

[0027] In an alternate embodiment, a dielectric layer 12 having an opening to a region 14 to which contact is to be made is formed over a substrate assembly 16 as described with FIG. 1. A barrier layer 70 is then formed over the dielectric 12 and contacts region 14 as depicted in FIG. 7. A blanket layer of conductive plug material 10 is then formed over the barrier 70. Wafer processing continues in a process similar to that described for FIGS. 1-6. In this embodiment, the barrier layer 70 separates the poly layer 10 from the structure 14 to which contact is to be made. The barrier layer reduces or eliminates aluminum atoms from diffusing through the poly into the underlying layer. This is a concern especially when the underlying layer is a doped region in a silicon substrate or another silicon structure. A barrier layer of titanium nitride can be formed using chemical vapor deposition (CVD), for example using TiCl₃ and NH₃ as precursors according to means known in the art. Other refractory metal nitrides may also be sufficient. The poly plug formed after an etch of the poly 10 of FIG. 7 is electrically coupled with structure 14 but does not contact structure 14.

[0028] The instant invention uses the plug material to absorb the metal which overlies and contacts the plug. The remaining metal is then oxidized to form the etch stop layer. The etch stop layer is self-aligned as no patterned photoresist layer is necessary for its formation.

[0029] While this invention has been described with reference to illustrative embodiments, this description is not meant to be construed in a limiting sense. Various modifications of the illustrative embodiments, as well as additional embodiments of the invention, will be apparent to persons skilled in the art upon reference to this description. It is therefore contemplated that the appended claims will cover any such modifications or embodiments as fall within the true scope of the invention. 

What is claimed is:
 1. A method for forming a patterned layer comprising the following steps: providing a first layer comprising a first material and a second material different from said first material; forming a second layer which overlies and contacts said first and second materials; and processing said first and second layers such that at least a majority of said second layer overlying said second material is absorbed by said second material and at least a majority of said second layer overlying said first material is not absorbed by said first material, wherein said absorption of said second layer by said second material results in a patterned second layer.
 2. The method of claim 1 further comprising the step of oxidizing said second layer subsequent to said step of processing said first and second layers.
 3. The method of claim 2 wherein during said oxidizing step an oxide layer forms over said second material, further comprising the step of etching said oxide layer over said second material to expose said second material.
 4. The method of claim 2 wherein said first material is a dielectric, said second material is silicon and said second layer is aluminum.
 5. The method of claim 2 wherein said first material is a dielectric, said second material is polycrystalline silicon and said second layer is a metal selected from the group consisting of magnesium and zinc.
 6. The method of claim 1 wherein said step of providing said first layer comprises the following steps: forming a dielectric layer having a hole therein; providing a blanket layer comprising said second material over said dielectric layer and in said hole; planarizing said blanket layer such that said blanket layer is removed from an upper surface of said dielectric layer and remains in said hole.
 7. The method of claim 6 further comprising the step of forming a barrier layer at least within said hole, wherein said barrier layer underlies said second material subsequent to said step of providing said blanket layer.
 8. The method of claim 6 wherein said step of providing said blanket layer comprises the step of providing a refractory metal nitride layer.
 9. A method used during the formation of a semiconductor device comprising the following steps: providing a conductive layer, a first dielectric layer having a hole therein, and a conductive plug which fills said hole and is electrically coupled with said conductive layer; forming an oxidizable layer having a first portion which contacts said first dielectric layer and a second portion which contacts said conductive plug; diffusing said second portion of said oxidizable layer into said plug; subsequent to said diffusing step, oxidizing said first portion of said oxidizable layer to form an oxide layer; subsequent to said oxidizing step, forming at least one layer over said plug and over said oxide layer; and etching said at least one layer using said oxide layer as an etch stop.
 10. The method of claim 9 further comprising the step of providing a barrier layer which separates said plug from said first dielectric layer and from said conductive layer.
 11. The method of claim 9 wherein said conductive plug comprises polycrystalline silicon and said oxidizable layer comprises aluminum.
 12. A method for providing a self-aligned etch stop layer comprising the following steps: providing a first layer having a hole therein; forming a second layer within said hole; providing an oxidizable layer having a first portion over said first layer and a second portion over said second layer; diffusing said second portion of said oxidizable layer into said second layer; subsequent to said diffusing step, oxidizing said first portion of said oxidizable layer thereby forming an etch stop layer, wherein said second portion of said oxidizable layer remains substantially unoxidized.
 13. The method of claim 12 wherein a portion of said oxidizable layer diffused into said second layer oxidizes during said oxidizing step, and said method further comprising the step of etching said oxidized portion of said oxidizable layer over said second layer.
 14. The method of claim 12 wherein said first layer, in cross section, comprises first and second sidewalls which define said hole and said method further comprises the step of forming a barrier layer over said first and second sidewalls prior to said step of forming said second layer within said hole
 15. The method of claim 12 further comprising the following steps: subsequent to said oxidizing step, forming a third layer over said etch stop layer; etching said third layer thereby forming a hole therein and exposing at least a portion of said second layer and a portion of said etch stop layer.
 16. A method for forming a self-aligned etch stop layer during the formation of a semiconductor device comprising the following steps: providing a semiconductor substrate assembly comprising a conductive structure; providing a dielectric layer having an opening therein which exposes said conductive structure; forming a silicon plug within said opening; forming a metal layer having a first portion over said dielectric layer and a second portion which contacts said plug; heating said metal layer such that said second portion is diffused into said plug; and subsequent to said heating step, oxidizing at least said first portion of said metal layer to form a metal oxide etch stop layer.
 17. The method of claim 16 wherein an oxide layer forms over said plug during said step of oxidizing said metal layer and said method further comprises the step of etching said oxide layer over said plug to expose said plug.
 18. The method of claim 16 further comprising the step of forming a barrier layer which contacts said conductive structure prior to said step of forming said plug.
 19. The method of claim 18 wherein said step of forming said barrier layer comprises the step of forming a refractory metal nitride barrier layer.
 20. The method of claim 16 wherein said metal is aluminum and said plug comprises polycrystalline silicon.
 21. The method of claim 20 wherein said heating step heats said aluminum to a temperature of between about 400° C. and about 500° C.
 22. The method of claim 21 wherein said heating step is performed for a duration of between about 30 seconds and about five minutes.
 23. The method of claim 16 wherein said metal is a material selected from the group consisting of magnesium and zinc and said plug comprises polycrystalline silicon.
 24. A method used during the formation of a semiconductor device comprising the following steps: providing a semiconductor substrate assembly comprising a conductive feature, a first dielectric layer, and a conductive plug formed within said first dielectric layer and electrically coupled with said conductive feature, forming a first conductive layer having a first portion over said first dielectric layer and a second portion over said conductive plug; processing said first conductive layer such that said second portion of said first conductive layer is absorbed into said conductive plug and at least a majority of said first portion of said first conductive layer remains over said first dielectric layer; subsequent to said step of processing said first conductive layer, oxidizing said first portion of said first conductive layer; forming a second dielectric layer over said plug and said oxidized first conductive layer; etching said second dielectric layer to expose said plug and a portion of said oxidized first conductive layer, wherein said oxidized first conductive layer and said plug resist said etching; and subsequent to said etching, forming a second conductive layer over said second dielectric layer and over said plug, wherein said second conductive layer is electrically coupled with said plug. 